By John Lau, Cheng Lee, C. Premachandran, Yu Aibin

A accomplished consultant to 3D MEMS packaging tools and ideas Written through specialists within the box, complicated MEMS Packaging serves as a priceless reference for these confronted with the demanding situations created by means of the ever-increasing curiosity in MEMS units and packaging. This authoritative advisor provides state of the art MEMS (microelectromechanical platforms) packaging recommendations, corresponding to low-temperature C2W and W2W bonding and 3D packaging. This definitive source is helping you decide trustworthy, artistic, high-performance, powerful, and within your means packaging options for MEMS units. The booklet also will reduction in stimulating additional study and improvement in electric, optical, mechanical, and thermal designs in addition to fabrics, procedures, production, checking out, and reliability. one of the themes explored: complex IC and MEMS packaging tendencies MEMS units, advertisement purposes, and markets greater than 360 MEMS packaging patents and 10 3D MEMS packaging designs TSV for 3D MEMS packaging MEMS wafer thinning, dicing, and dealing with Low-temperature C2C, C2W, and W2W bonding Reliability of RoHS-compliant MEMS packaging Micromachining and water bonding concepts Actuation mechanisms and built-in micromachining Bubble change, optical change, and VOA MEMS packaging Bolometer and accelerameter MEMS packaging Bio-MEMS and biosensor MEMS packaging RF MEMS switches, tunable circuits, and packaging

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MEMS package,” Yoshikawa, Yasuhiro, Tajiri, Hiroyuki, JP2006321016 (A)—2006-11-30. 113. , KR20010051498 (A)—200106-25. 114. “Method of packaging MEMS,” Ouellet, Luc (CA), Chowdhury, Mamur (CA), EP1734001 (A2)—2006-12-20. 115. “Display device having a movable structure for modulating light and method thereof,” Miles, Mark W. (US), US2006274074 (A1)—2006-12-07. 116. “Production method of glass penetrating wiring board, glass penetrating wiring board, and probe card and packaging element using glass penetrating wiring board,” Fujimoto, Satoshi (JP), WO2006129848 (A1)—2006-12-07.

2006. 2006. 2006. 2006. 2005. 2005. 2005. 2005. 2005. 2005. 2005. 2005. 2005. 2005. 2004. 2004. 2004. 2004. 2004. 2004. 2003. 2003. 2003. 2003. 2002. 2002. 2002. 2002. 2001. 2001. 2001. /Date 1. “Wafer level chip size package for MEMS devices and method for fabricating the same,” Wang, Zhiqi (CN), Yu, Guoqing (CN) (+2), US2009057868 (A1)—2009-03-05. 2. “Method for packaging an optical MEMS device,” Khonsari, Nassim (US), Chui, Clarence (US), EP2029473 (A2)—200903-04. 3. “Patterned contact sheet to protect critical surfaces in manufacturing processes,” Ya, Michael Wang Qing (US), Zhang, Junhong (US), CN101323428 (A)—2008-12-17.

Polymer object optical fabrication process,” Cregger, Robert Brian (US), WO2008063433 (A2)—2008-05-29. 42. “X-Y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging,” Seeger, Joseph (US), Nasiri, Steven S. (US) (+1), US2008115579 (A1)—2008-05-22. 43. “MEMS package, and manufacturing method therefore, as well as integrated circuit including MEMS package,” Manuel, Carmona Flores, Kihara, Tatsuji (+1), JP2008091334 (A)— 2008-04-17. 29 30 Chapter One 44.

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